Liquid high solids binder composition
US10767050B2 · kind B2 · utility
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44Claims
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Key dates
| Filing date | Nov 24, 2017 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Mar 18, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention described herein pertains to formaldehyde free, thermosetting liquid high solids binder compositions having rapid cure times on thermal curing and slow cure times at ambient temperatures so that the uncured binder compositions and products which comprise the uncured binder compositions have improved shelf lives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.