Method and an apparatus for performing a plasma chemical vapour deposition process and a method
US10767264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2017 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Oct 3, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P40/57
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for performing a plasma chemical vapour deposition process including a mainly cylindrical resonator having an outer cylindrical wall and an inner coaxial cylindrical wall defining therebetween a resonant cavity operable at an operating frequency. The resonant cavity extends in a circumferential direction around a cylindrical axis of the inner and outer cylindrical wall. The outer cylindrical wall includes an input port connectable to an input waveguide. The inner cylindrical wall includes slit sections extending in a circumferential direction around the cylindrical axis. A greatest dimension defining the aperture of the slit sections is smaller than half the wavelength of the operating frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.