Patent · US Active

Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

US10767275B2 · kind B2 · utility

0Cited by

3References

19Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Heiko Brunner · Berlin, DE
Lars Kohlmann · Berlin, DE
Agnieszka Witczak · Berlin, DE
Olivier Mann · Berlin, DE

Key dates

Filing date	Aug 30, 2016
Grant date	Sep 8, 2020
Priority date	—
Expiry date	Jun 8, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G73/00
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.