Patent · US Active

Apparatuses and methods for blue-cut lenses

US10768448B2 · kind B2 · utility

1Cited by

0References

11Claims

0Family size

Assignee

Essilor International · FR

Inventors

Haifeng Shan · Dallas, US
Hao-Wen Chiu · Palm Harbor, US
Aref Jallouli · Midland, US

Key dates

Filing date	Sep 20, 2017
Grant date	Sep 8, 2020
Priority date	—
Expiry date	Sep 20, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG02C2202/10
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A blue-cut wafer can be coupled to a lens, such that the blue-cut wafer can be configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers, preferably from 400 nanometers to 460 nanometers. The blue-cut wafer can permit light having a second wavelength range, the second wavelength range being greater than the first wavelength range, and homogenize a color appearance and a blue-cut performance level of the blue-cut wafer based on the blue-cut wafer having a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.