Microwave integrated quantum circuits with cap wafer and methods for making the same
US10769546B1 · kind B1 · utility
14Cited by
126References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2018 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Aug 27, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/933
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quantum computing system that includes a quantum circuit device having at least one operating frequency; a first substrate having a first surface on which the quantum circuit device is disposed; a second substrate having a first surface that defines a recess of the second substrate, the first and second substrates being arranged such that the recess of the second substrate forms an enclosure that houses the quantum circuit device; and an electrically conducting layer that covers at least a portion of the recess of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.