Multilayer electronic component and method of manufacturing the same
US10770232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2018 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Jul 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1209
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.