Semiconductor apparatus, method for manufacturing the same and electric power conversion device
US10770367B2 · kind B2 · utility
0Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2018 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Oct 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes: a substrate including a circuit pattern on an upper surface side and a metal plate on a lower surface side; a semiconductor device joined to the circuit pattern via a conductive component; a case located to surround the substrate; a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case; and a bonding agent bonding the case and the metal plate on a side face of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.