Patent · US Active

Package, and method of manufacturing a package comprising an enclosure and an integrated circuit

US10770862B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

NOKIA TECHNOLOGIES OY · FI

Inventors

Rudi O'Reilly Meehan · Dublin, IE
Akshat Agarwal · Navan, IE
Nicholas Jeffers · Wicklow, IE

Key dates

Filing date	Sep 6, 2018
Grant date	Sep 8, 2020
Priority date	—
Expiry date	Sep 6, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/02438
WIPO fieldOptics
WIPO sectorInstruments

Abstract

There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.