Stiffener cooling structure
US10772188B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2019 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Jun 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for providing a stiffener and cooling to a printed circuit board includes a printed circuit board coupled to a top surface of a stiffening cooling structure, where a lower surface of the printed circuit board is opposite the top surface of the stiffening cooling structure. One or more channels of the stiffening cooling structure defined by the top surface of the stiffening cooling structure, a bottom surface of the stiffening cooling structure, and one or more support members, where the one or more support members are positioned between the top surface of the stiffening cooling structure and the bottom surface of the stiffening cooling. One or more apertures in the top surface of the stiffening cooling structure directs airflow from the one or more channels of the stiffening cooling structure to one or more components disposed on a top surface of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.