Board-to-board contactless connectors and methods for the assembly thereof
US10772192B2 · kind B2 · utility
1Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2016 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Apr 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.