Low transmission loss copper foil and methods for manufacturing the copper foil
US10772199B2 · kind B2 · utility
3Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2019 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 μm3/μm2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.