Sealed package including electronic device and power source

US10772228B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• John K. Day · Chandler, US
• Michael J. Nidelkoff · White Bear Lake, US
• Kris A. Peterson · Minneapolis, US
• Andrew J. Ries · Lino Lakes, US
• David A. Ruben · Mesa, US
• Craig L. Wiklund · Bloomington, US

Key dates

• Filing date: Oct 21, 2016
• Grant date: Sep 8, 2020
• Expiry date: Oct 21, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E60/10
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.