Process for depositing dry powder particles onto a substrate and adhesively bonding the particles to the substrate
US10773275B2 · kind B2 · utility
0Cited by
11References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 16, 2016 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2401/32
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to adhesively bond the particles to a pressure-sensitive adhesive surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.