Surface-modified adhesives
US10773490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2010 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | May 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Surface-modified adhesives may be prepared by contacting an adhesive layer to an at least partially discontinuous layer on a releasing substrate and removing the adhesive layer such that at least a portion of the at least partially discontinuous layer adheres to the adhesive surface. The modified adhesive surface remains an adhesive surface. The modified adhesive layer can be used to prepare adhesive articles, including articles containing multiple surface-modified adhesive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.