Bonding of composite materials
US10773508B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Mar 18, 2017 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Dec 15, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249921
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.