Multisurface simultaneous sputtering and shuttering
US10774417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2017 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Aug 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3447
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A deposition system comprises a vacuum chamber having a cylindrical inner wall, a cylindrical parts carousel disposed concentrically inside the cylindrical inner wall of the vacuum chamber, and one or more deposition sources arranged to flow deposition material onto the cylindrical parts carousel. A cylindrical shutter assembly is disposed concentrically inside the cylindrical inner wall of the vacuum chamber, and has (1) a shuttered position in which the cylindrical shutter assembly blocks the one or more deposition sources from depositing onto the parts carousel and (2) an unshuttered position in which the cylindrical shutter assembly does not block the one or more deposition sources from depositing onto the parts carousel. A drive train rotates the cylindrical shutter assembly between the shuttered and unshuttered positions. The drive train not operatively connected to rotate the cylindrical parts carousel. The deposition sources may include inner and outer sputter sources.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.