Panel interconnectable with similar panels for forming a covering
US10774540B2 · kind B2 · utility
3Cited by
39References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2019 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Mar 8, 2039 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/043
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The invention relates to a panel, in particular a floor panel, interconnectable with similar panels for forming a covering. The invention also relates to a covering consisting of mutually connected floor panels according to the invention. The invention further relates to a method of assembling multiple floor panels for forming a covering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.