Tight temperature control at a thermal load with a two phase pumped loop, optionally augmented with a vapor compression cycle
US10775110B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2018 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Aug 8, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F27/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A two-phase pump loop (TPPL) for dissipating a thermal load during operation of an apparatus includes a coolant, a vapor/liquid receiver, a pump, an evaporator, a condenser, a valve (V1) configured to regulate a pressure at an outlet of the condenser; a valve (V2) having a control set point set equivalent to a low pressure (PL) measured in the vapor/liquid receiver; and a controller configured to control the set points of V1 and V2. The TPPL is configured to cool the thermal load with tight control of the temperature of the coolant that is cooling the apparatus. The TPPL may be combined with a vapor cycle system (VCS) to provide a thermal management system with the VCS being configured to use the same or different coolant than the TPPL.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.