Patent · US Active

Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component

US10775253B2 · kind B2 · utility

0Cited by

1References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Heiko Stahl · Reutlingen, DE
Arne Dannenberg · Metzingen, DE
Daniel Haug · Neuffen, DE
Daniel Kaercher · Tuttlingen, DE
Michaela Mitschke · Reutlingen, DE
Mike Schwarz · Aspenhausiedlung, DE
Timo Lindemann · Reutlingen, DE

Key dates

Filing date	Aug 24, 2017
Grant date	Sep 15, 2020
Priority date	—
Expiry date	Aug 24, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2201/0264
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.