Photonics fabrication process performance improvement
US10775559B2 · kind B2 · utility
4Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2019 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Apr 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F71/121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A plurality of waveguide structures are formed in at least one silicon layer of a first member. The first member includes: a first surface of a first silicon dioxide layer that is attached to a second member that consists essentially of an optically transmissive material having a thermal conductivity less than about 50 W/(m·K), and a second surface of material that was deposited over at least some of the plurality of waveguide structures. An array of phase shifters is formed in one or more layers of the first member. An array of temperature controlling elements are in proximity to the array of phase shifters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.