Patent · US Active

Low footprint optical interconnects

US10775572B1 · kind B1 · utility

1Cited by
25References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 7, 2018
Grant dateSep 15, 2020
Priority date—
Expiry dateMay 7, 2038

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49144
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.