Self-determining inspection method for automated optical wire bond inspection
US10776912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2017 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Jun 27, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for self-determining optical inspection of wire bonds of semiconductor components. The method is an automated optical wire bond inspection method that may include obtaining an image of a semiconductor component having wire bonds. The method may also include detecting a plurality of wire bonds on the semiconductor component image so that a wire between at least two of the plurality of detected wire bonds may be detected. Further, the method may include determining an inspection region of interest corresponding to at least one detected wire bond and at least one detected wire. The method may then include inspecting the detected wire bond along the region of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.