Chip capacitor and method for manufacturing the same
US10777360B2 · kind B2 · utility
0Cited by
12References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 16, 2019 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Apr 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/85
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.