Biased pulse CMP groove pattern

US10777418B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• John Nguyen · Chadds Ford, US
• Tony Quan Tran · Bear, US
• Jeffrey James Hendron · Elkton, US
• Jeffrey Robert Stack · Clayton, US

Key dates

• Filing date: Oct 5, 2017
• Grant date: Sep 15, 2020
• Expiry date: Oct 5, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67017
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.