Method of production of a structure including a high thermal conductivity substrates and devices on it
US10777429B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Oct 17, 2018 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Oct 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/254
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There may be provided a method for generating a structure, the method may include receiving multiple donor structures that comprise multiple mesas; placing the multiple donor structures on a substrate that lacks a semiconductor layer that covers the entire substrate; and performing a manufacturing process that comprises coupling the multiple mesas to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.