Semiconductor module
US10777489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2018 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Nov 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73263
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.