Package structure and method of manufacturing the same
US10777518B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2019 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | May 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q19/062
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a plurality of sub-package structures, a second encapsulant, a second RDL structure and a second conductive terminal. The sub-package structure includes a die, first TIVs, a first encapsulant and an antenna element. The die has a first side and a second side. The first TIVs are laterally aside the die. The first encapsulant encapsulates sidewalls of the die and sidewalls of the TIVs. The antenna element is on the first side of the die, and on the TIVs and the first encapsulant. The second encapsulant encapsulates sidewalls of the sub-package structures. The second RDL structure is electrically connected to the plurality of sub-package structures. The second conductive terminal is electrically connected to the sub-package structures through the second RDL structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.