Chip-to-chip interface comprising a waveguide with a dielectric part and a conductive part, where the dielectric part transmits signals in a first frequency band and the conductive part transmits signals in a second frequency band
US10777865B2 · kind B2 · utility
1Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2018 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Oct 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L12/40052
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band is transmitted through the dielectric part, and a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.