Arrangement and method for electromagnetic shielding
US10779393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2017 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Dec 8, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.