Heat sink
US10779437B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Feb 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure is a heat sink used for an electronic component. The heat sink includes a shell body, a fan, and a thermally-conductive strip. The thermally-conductive strip abuts against the shell body. The shell body has an internal space and a side wall, and a channel is formed in the side wall of the shell body for a coolant fluid to flow. At two ends of the channel, a coolant fluid inlet and a coolant fluid outlet are respectively formed on an outer wall surface of the side wall. In this way, when flowing through the shell body, the coolant fluid brings heat of the shell body away. Therefore, heat dissipation efficiency can be substantially increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.