Thermally conductive composition
US10779450B2 · kind B2 · utility
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Key dates
| Filing date | Jul 11, 2019 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Jul 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F1/37
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive composition is provided, which has a base material; and at least one of a permittivity adjusting filler having a lower permittivity than the base material and a high permeability filler having a higher permeability than the base material. The entire thermally conductive composition has a relative permeability higher than 1 and a relative permittivity of 7 or lower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.