Apparatus and method for the manufacturing of printed wiring boards on a substrate
US10779451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2014 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Apr 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/013
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.