Methods for processing substrate in semiconductor fabrication
US10780461B2 · kind B2 · utility
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3References
20Claims
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Assignee
Inventors
Key dates
| Filing date | May 29, 2015 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Apr 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of processing a substrate in semiconductor fabrication is provided. The method includes supplying a mixture to a process module. The method further includes detecting the concentration of a substance in the mixture. The method also includes dispensing the mixture over a substrate in the process module. In addition, the method includes supplying a supply solution including the substance to the process module and dispensing the supply solution over the substrate if the concentration of the substance in the mixture is less than a desired value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.