Thermal interface material including crosslinker and multiple fillers
US10781349B2 · kind B2 · utility
5Cited by
187References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2016 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Mar 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0542
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.