Modular flooring assemblies
US10781595B2 · kind B2 · utility
6Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2016 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Sep 21, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/022
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Disclosed herein is a modular flooring assembly including a flooring component adhered to a first tray substrate and a second tray substrate which are interconnected to form an assembled tray substrate. The assembled tray substrate may be interconnected with additional assembled tray substrates to form a modular floor suitable for most flooring applications. The flooring component may be tile or wood or other materials commonly used in flooring applications. Convention fill-in grout or a snap-in grout may be used with the modular flooring assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.