Crack structures, tunneling junctions using crack structures and methods of making same
US10782249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2016 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Dec 14, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a method of making a crack structure on a substrate, the crack structure being usable as a tunneling junction structure in a nanogap device, including the controlled fracture or release of a patterned layer under built-in stress, thereby forming elements separated by nanogaps or crack-junctions. The width of the crack-defined nanogap is controlled by locally release-etching the film at a notched bridge patterned in the film. The built-in stress contributes to forming the crack and defining of the width of the crack-defined nanogap. Further, by design of the length of the bridge in a range between sub-μπι to >25μαι, the separation between the elements, defined by the width of the crack-defined nanogaps, can be controlled for each individual crack structure from <2 nm to >100 nm. The nanogaps can be used for tunneling devices in combination with nanopores for DNA, RNA or peptides sequencing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.