Method for producing a reflection-reducing layer system

US10782451B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Ulrike Schulz · Jena, DE
• Peter Munzert · Jena, DE
• Sabrina Wolleb · Jena, DE
• Friedrich Rickelt · Jena, DE
• Heiko Knopf · Jena, DE

Key dates

• Filing date: Dec 20, 2017
• Grant date: Sep 22, 2020
• Expiry date: Dec 20, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31138
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method for producing a reflection-reducing layer system is disclosed. In an embodiment, a method includes depositing an organic layer on the substrate, generating a nanostructure in the organic layer by a plasma etching process, applying a cover layer to the nanostructure, wherein the organic layer, the nanostructure and the cover layer together form a reflection-reducing structure, wherein the cover layer comprises an inorganic material or an organosilicon compound, and wherein the cover layer is at least 5 nm thick and performing a post-treatment after applying the cover layer, wherein a material of the organic layer is at least partially removed, decomposed or chemically converted, and wherein an effective refractive index neff,2 of the reflection-reducing structure after the post-treatment is smaller than an effective refractive index neff,1 of the reflection-reducing structure before the post-treatment.