Silicon wafer processing device and method

US10782615B2 · kind B2 · utility

Assignee

• SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD · CN

Inventors

• Gang Wang · Beijing, CN
• Yichao Shi · Shanghai, CN
• Jie Jiang · Shanghai, CN
• Dongliang Huang · Shanghai, CN
• Haijun SONG · Laishui, CN

Key dates

• Filing date: Apr 27, 2018
• Grant date: Sep 22, 2020
• Expiry date: Apr 27, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Disclosed is a silicon wafer processing device; a pre-aligned optical assembly and an edge exposure assembly are provided on a synchronous bi-directional motion module, reducing the occupied space of the device and saving the installation cost; and furthermore, a synchronous bi-directional motion module, a rotation unit and a position compensation unit on a bottom plate are controlled by means of a control assembly, so as to reduce the operational complexity; and moreover, the synchronous bi-directional motion module is controlled to drive the pre-aligned optical assembly and the edge exposure assembly to simultaneously move, so that the operations of pre-aligning and edge exposure can be performed on silicon wafers of different sizes, thereby saving the switching time and increasing the work efficiency. Further disclosed is a method for processing a silicon wafer using a silicon wafer processing device.