Complexity reduction of objects via hole filling
US10783718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2018 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Oct 12, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2219/2021
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed for removing details from three dimensional (3D) objects, such as cavities and holes. Complexity reduction via hole filling reduces storage, transfer, and rendering costs without adversely impacting quality and is implemented in an automated manner. In some examples, a 3D object is dilated and eroded, and undesirable webbing is removed to preserve a higher percentage of exterior detail. Holes and cavities, which are obscured in many viewing angles, are filled in (e.g., removed), thereby reducing the burden of storing and processing hidden interior surfaces. Various approaches, leveraging distance fields, may be combined for improved benefit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.