Light emitting diode package and light emitting diode module
US10784239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2019 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Sep 10, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.