Method of manufacturing micro-LED array display devices with CMOS cells
US10784241B2 · kind B2 · utility
7Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2018 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Sep 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.