Mass transfer method for micro-LEDs with a temperature-controlled adhesive layer
US10784400B2 · kind B2 · utility
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Key dates
| Filing date | Dec 7, 2019 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Dec 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mass transfer method for Micro-LEDs with a temperature-controlled adhesive layer, including: configuring a self-assembling structure based on Micro-LED dies and a transfer substrate having a self-receiving structure coated on its surface with a temperature-controlled adhesive layer; distributing the Micro-LED dies in water, soaking the transfer substrate in water and heating water to perform self-assembling; carrying out transferring and removing the transfer substrate to separate Micro-LED dies from a transfer substrate then onto a target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.