Package support structure and light emitting device including same
US10784412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2018 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Aug 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8583
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing. The package support structure provided in the present invention achieves the effect of reducing an upper piece error and the purpose of effectively removing the heat energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.