Patent · US Active

Method of producing an optoelectronic component

US10784421B2 · kind B2 · utility

1Cited by
1References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 23, 2017
Grant dateSep 22, 2020
Priority date
Expiry dateAug 23, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/0362
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of producing an optoelectronic component includes providing a carrier having an upper side; providing a mat configured as a fiber-matrix semifinished product and having a through-opening; arranging an optoelectronic semiconductor chip over the upper side of the carrier; arranging the mat over the upper side of the carrier such that the optoelectronic semiconductor chip is arranged in the opening of the mat; and compacting the mat to form a composite body including the mat and the optoelectronic semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.