Dielectric-encapsulated wideband metal radome
US10784571B2 · kind B2 · utility
1Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2017 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Dec 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/422
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A low-loss millimeter-wave radome is provided. The low-loss millimeter wave radome includes a perforated and plated metallic plate and a low-loss dielectric encapsulation material to encapsulate the perforated and plated metallic plate. The perforated and plated metallic plate includes multiple metallic sheets and electrically conductive plating. The multiple metallic sheets respectively define a periodic array of sub-wavelength holes and are laminated together such that the periodic array of sub-wavelength holes combines into a periodic array of perforations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.