Golden finger design methodology for high speed differential signal interconnections
US10784607B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 21, 2019 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | May 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1034
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connector assembly is disclosed to reduce discontinuity impedance between golden finger connectors and components on a circuit board. The assembly includes a circuit board including a connector edge. A plurality of connectors is formed on the connector edge on a first surface of the circuit board. A ground plane is formed on part of the circuit board on a second opposite surface of the first surface. The ground plane leaves the second opposite surface under the connector edge exposed. A ground loop is formed on the second opposite surface under at least two of the plurality of connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.