Imaging performance optimization methods for semiconductor wafer inspection
US10785394B2 · kind B2 · utility
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6References
19Claims
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Key dates
| Filing date | Jul 11, 2016 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Jul 11, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/956
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection system may include an optical component configured to deliver inspection light to a subject and a detector configured to obtain an image of the subject based on the inspection light delivered to the subject. The inspection system may also include a processor in communication with the optical component and the detector. The processor may be configured to: measure an aberration of the optical component based on the image of the subject obtained by the detector; and adjust the optical component to compensate for a change in the aberration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.