Fabrication of piezoelectric transducer including integrated temperature sensor
US10785567B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2020 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Jun 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R29/001
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a piezoelectric transducer may include interleaving a plurality of layers of piezoelectric material with a plurality of conductive layers including a first conductive layer, one or more second conductive layers, and one or more third conductive layers, coupling the first conductive layer to a first electrode, wherein an electrical impedance of the first conductive layer varies as a function of a temperature internal to the piezoelectric transducer, and such that a measurement signal indicative of the electrical impedance is generated at the first electrode, coupling the one or more second conductive layers to a second electrode, and coupling the one or more third conductive layers to a third electrode, such that an electrical driving signal driven to the second electrode and the third electrode causes mechanical vibration of the piezoelectric transducer as a function of the electrical driving signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.