Printed circuit board with heat sink
US10785864B2 · kind B2 · utility
1Cited by
14References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Sep 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.