Circuit board and production method therefor
US10785879B2 · kind B2 · utility
0Cited by
7References
6Claims
0Family size
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Key dates
| Filing date | Jul 10, 2018 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Jul 10, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12458
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.